Wafer surface grinder


Ultra-precision surface grinder that achieves high flatness, high smooth surface, low damage layer, and integrated machining process

Usage 300mmウェーハの超精密平面研削
material silicon wafer


  • In pursuit of rigidity, two horizontal processing heads are arranged in a space-saving manner.
  • By adopting a horizontal groove that pursues rigidity, it achieves high flatness and low damage grinding of the silicon wafer surface, reduces the load in the post-process, and improves total productivity.
  • High-rigidity air static pressure spindles are used for grinding wheel spindles and workpiece spindles.