Semiconductor Wafer Surface Grinder

SIG-V4

SIG-V4

Rigidly structured Semiconductor Wafer Surface Grinder

Usage/material

Grinding machine for semiconductor-related materials including hard brittle materials such as sapphire substrates, SiC substrates, and ceramics, etc.

Features

Unprecedented, overwhelming machine rigidity.

The high rigidity suppresses negative factors during grinding, enabling both high efficiency and low damage.

The high-rigidity, large-diameter table enables batch grinding of 6-inch wafers.

The work piece profile is measured by a non-contact thickness measurement system, enabling support for batch grinding with high reliability.

Dress-less grinding with original grinding wheel, maintaining stable quality and eliminating downtime.

Automatic transport system for lap pasting plates.

Grinding programs can be operated easily with the recipe control.

Semiconductor Wafer Surface Grinder, Sample
  • Machining example 1
  • Machining example 2
  • Machining example 3
  • Machining example 4
Go back to the top of the page
  • To those who wish a new deal
WAIDA MFG. CO., LTD.
2121 Katano-machi, Takayama, Gifu 506-0824
TEL:0577-32-0390(main)/ FAX:0577-37-0020

COPYRIGHT © WAIDA MFG.CO.,LTD. All Rights Reserved.